Memory ICs

Browse 41,088 reviewed memory ics — specs, datasheets, engineer ratings and production-lifecycle scores.

Subcategories

41088 parts

PartManufacturerRating
SANDISK SDINBDG4-16G SANDISK —
MAXIM DS2431+ MAXIM —
IDCHIP AT24C16 IDCHIP —
MICROCHIP 24AA16T-I/OT MICROCHIP —
Winbond W25Q256JVEIQ Winbond —
MICROCHIP 23LC1024T-I/SN MICROCHIP —
MICROCHIP AT24C08C-STUM-T MICROCHIP —
MICROCHIP AT25080B-SSHL-T MICROCHIP —
Winbond W25Q64JWSSIQ Winbond —
Infineon/CYPRESS FM25V10-GTR Infineon/CYPRESS —
GigaDevice Semicon Beijing GD25WD10CTIGR GigaDevice Semicon Beijing —
ROHM BR24G512FJ-5AE2 ROHM —
MICROCHIP AT24C02D-STUM-T MICROCHIP —
MK MKDV8GIL-AST MK —
FUDAN MICRO FM24C02C-SO-T-G FUDAN MICRO —
Zetta ZD24C512A-MAGMT Zetta —
Infineon/CYPRESS FM24CL04B-GTR Infineon/CYPRESS —
MK MKDV32GCL-STP MK —
MICROCHIP AT24C02C-STUM-T MICROCHIP —
ROHM BR25H010FVM-2CTR ROHM —
Winbond W9864G6KH-6 Winbond —
ST M24C16-FMC6TG ST —
BL BL24C64A-PARC BL —
GigaDevice Semicon Beijing GD25Q256EYIGR GigaDevice Semicon Beijing —
Winbond W25N02KVZEIR Winbond —
MXIC MX25U6432FZNI02 MXIC —
MICROCHIP 24LC02BT-I/SN MICROCHIP —
Winbond W25Q128JWPIQ Winbond —
ISSI IS61WV51216EDBLL-10TLI ISSI —
MICROCHIP 24AA64T-I/MNY MICROCHIP —
SAMSUNG K4A8G165WG-BCWE SAMSUNG —
MAXIM DS28EC20P+T MAXIM —
Winbond W25Q32JVZPIQ Winbond —
MICROCHIP 24CW1280T-I/OT MICROCHIP —
MXIC MX25V8035FZUI MXIC —
Infineon/CYPRESS CY7C1009D-10VXIT Infineon/CYPRESS —
MICROCHIP AT24C02D-SSHM-T MICROCHIP —
Zetta ZD24C16A-SSGMB Zetta —
GigaDevice Semicon Beijing GDQ2BFAA-WQ GigaDevice Semicon Beijing —
MICROCHIP 11AA02E48T-I/TT MICROCHIP —
Winbond W25Q512JVFIQ Winbond —
Winbond W25Q80DVUXIE Winbond —
HYNIX H5AN8G6NDJR-XNC HYNIX —
BOYAMICRO BY25Q128ASSIG(R) BOYAMICRO —
micron MT41K256M16TW-107 IT:P micron —
ST M24256-BRMN6TP ST —
Infineon/CYPRESS CY7C1010DV33-10ZSXIT Infineon/CYPRESS —
ST M24M01-RDW6TP ST —
RENESAS AT45DB081E-SHN-T RENESAS —
GigaDevice Semicon Beijing GD25Q16ETIGR GigaDevice Semicon Beijing —