Memory ICs

Browse 41,088 reviewed memory ics — specs, datasheets, engineer ratings and production-lifecycle scores.

Subcategories

41088 parts

PartManufacturerRating
FUDAN MICRO FM25Q16A-SO-T-G FUDAN MICRO
onsemi CAT24C256YI-GT3 onsemi
Winbond W25Q512JVEIQ TR Winbond
ST M95512-RDW6TP ST
MICROCHIP AT24C512C-XHM-T MICROCHIP
ST M95M01-RMN6TP ST
MICROCHIP AT24C16D-SSHM-T MICROCHIP
MICROCHIP AT24CM01-SSHD-T MICROCHIP
onsemi CAT24C08WI-GT3 onsemi
ST M24512-WMN6TP ST
Winbond W634GU6RB-11 Winbond
SAMSUNG KLUFG8RHGB-B0E1 SAMSUNG
onsemi CAT24M01WI-GT3 onsemi
JSMSEMI AT24C02D-SSHM-T JSMSEMI
Winbond W25X20CLSNIG Winbond
FMD(Fremont Micro Devices) FT24C1024A-USR-T FMD(Fremont Micro Devices)
HK HK24C16HA-USR-B HK
RENESAS AT25SF128A-SHB-T RENESAS
MK MKDV1GCL-ABA MK
BL BL24CM1A-NTRC BL
HANSCHIP semiconductor AT24C512CDRG HANSCHIP semiconductor
Nanya Tech NT5CC512M8EN-EK Nanya Tech
MXIC MX25R8035FZUIL0 MXIC
HYNIX H5TQ4G63EFR-RDC HYNIX
PUYA P25Q16SH-SSH-IR PUYA
MXIC MX25L25645GZNI-08G MXIC
XBLW 24C02S(XBLW) XBLW
MICROCHIP 25AA02E48T-I/SN MICROCHIP
IDCHIP AD24C02 IDCHIP
micron MT25QU256ABA8E12-1SIT micron
MAXIM DS28E01P-100+T MAXIM
ISSI IS66WVH8M8BLL-100B1LI ISSI
GigaDevice Semicon Beijing GD25Q40ETIGR GigaDevice Semicon Beijing
MICROCHIP SST26VF064B-104I/SM MICROCHIP
HYNIX H26M41208HPR HYNIX
MICROCHIP 24LC64T-E/SN MICROCHIP
PUYA P24C02A-SSH-MIR PUYA
micron MT40A512M16LY-075:E micron
ST M24C08-WMN6TP ST
MICROCHIP AT24C02D-MAHM-T MICROCHIP
ST M24C32-FMN6TP ST
Winbond W25Q80DVUXIE Winbond
HYNIX H5AN8G6NDJR-XNC HYNIX
BOYAMICRO BY25Q128ASSIG(R) BOYAMICRO
micron MT41K256M16TW-107 IT:P micron
ST M24256-BRMN6TP ST
Infineon/CYPRESS CY7C1010DV33-10ZSXIT Infineon/CYPRESS
ST M24M01-RDW6TP ST
RENESAS AT45DB081E-SHN-T RENESAS
GigaDevice Semicon Beijing GD25Q16ETIGR GigaDevice Semicon Beijing