HGSEMI HG25Q32BDQ/TR

HGSEMI · Memory ICs · MPN HG25Q32BDQ/TR

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Specifications

Memory Size32Mbit
Voltage - Supply2.3V~3.6V
Operating temperature-40℃~+125℃
Program / Erase Cycles100,000 cycles
Clock Frequency133MHz
FeaturesWrite enable latch;Power-on reset;Hardware write protection;Software write protection;Absolute write protection;Power l…
Data Retention - TDR (Year)20 Years
Block Erase Time(tBE)250ms@(64KB)
Page Programming Time (Tpp)500us
InterfaceSPI
Standby Supply Current1uA

Technical details

32Mbit 2.3V~3.6V 133MHz SPI DFN-8-EP(3x3) Memory (ICs) RoHS

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