Memory ICs

Browse 41,088 reviewed memory ics — specs, datasheets, engineer ratings and production-lifecycle scores.

Subcategories

• Serial Flash
• Parallel NOR Flash
• NAND Flash
• EEPROM
• SRAM/FRAM
• SDRAM/DDRx DRAM

41088 parts

Part	Manufacturer	Rating
XBLW 24C02BN(XBLW)	XBLW	—
MXIC MX35LF1GE4AB-Z4ITR	MXIC	—
ISSI IS61WV204816BLL-10TLI	ISSI	—
GigaDevice Semicon Beijing GD5F1GM7UEYIGR	GigaDevice Semicon Beijing	—
Winbond W25N01GVZEIG	Winbond	—
MXIC MX25V1635FZUI	MXIC	—
Winbond W9864G6KH-6I	Winbond	—
MICROCHIP AT24C256C-SSHL-T	MICROCHIP	—
MICROCHIP 24LC256T-I/SN	MICROCHIP	—
HYNIX H5TC4G63EFR-RDAR	HYNIX	—
Infineon/CYPRESS FM25CL64B-GTR	Infineon/CYPRESS	—
AP Memory APS1604M-3SQR-SN	AP Memory	—
Infineon/CYPRESS FM24W256-GTR	Infineon/CYPRESS	—
AP Memory APS6404L-SQN-SN	AP Memory	—
Winbond W25Q16JVSSIQ	Winbond	—
GigaDevice Semicon Beijing GD25Q64ESIGR	GigaDevice Semicon Beijing	—
Kingston EMMC04G-M627-Y02U	Kingston	—
MXIC MX35LF2GE4AD-Z4I	MXIC	—
Winbond W25Q128JVSIQ	Winbond	—
ISSI IS45S32200L-7BLA2	ISSI	—
Winbond W25Q512JVEIQ TR	Winbond	—
MICROCHIP AT24C16D-SSHM-T	MICROCHIP	—
Winbond W634GU6RB-11	Winbond	—
MK MKDV1GCL-ABA	MK	—
Winbond W25X20CLSNIG	Winbond	—
MXIC MX35LF1GE4AB-Z4I	MXIC	—
MXIC MX25R8035FZUIL0	MXIC	—
XBLW 24C02S(XBLW)	XBLW	—
AP Memory APS6404L-3SQR-ZR	AP Memory	—
ST M24C64-FMN6TP	ST	—
MAXIM DS28E01P-100+T	MAXIM	—
HYNIX H26M41208HPR	HYNIX	—
ST M24C08-RMN6TP	ST	—
ST M24C08-WMN6TP	ST	—
Winbond W25Q80DVSSIG	Winbond	—
Winbond W25Q256JWPIQ	Winbond	—
GigaDevice Semicon Beijing GD25Q16ESIGR	GigaDevice Semicon Beijing	—
ST M24C04-WMN6TP	ST	—
ST M24256-BWMN6TP	ST	—
SANDISK SDINBDG4-16G	SANDISK	—
ST M24C02-FMN6TP	ST	—
Winbond W25Q256JVEIQ	Winbond	—
Winbond W25Q64JWSSIQ	Winbond	—
ISSI IS61WV51216EDBLL-10TLI-TR	ISSI	—
onsemi CAT24C02TDI-GT3A	onsemi	—
MICROCHIP AT24C02D-STUM-T	MICROCHIP	—
Infineon/CYPRESS FM24CL04B-GTR	Infineon/CYPRESS	—
ST M24C32-RMN6TP	ST	—
Winbond W9864G6KH-6	Winbond	—
Winbond W25N02KVZEIR	Winbond	—